We have hosted the application thsim in order to run this application in our online workstations with Wine or directly.


Quick description about thsim:

Simulator for thermal conduction in solid material. Uses SPICE for calculations and wxWindows for providing Windows and Linux GUI.

Features:
  • Design Environment for models
  • 3D-OpenGL graphics output
  • Supports many versions of SPICE (e.g. LT-SPICE, PSPICE, WinSPICE, ngspice .)


Audience: Developers, End Users/Desktop.
User interface: Gnome, KDE, Win32 (MS Windows).
Programming Language: C++.
Categories:
3D Modeling, Electronic Design Automation (EDA)

Page navigation:

©2024. Winfy. All Rights Reserved.

By OD Group OU – Registry code: 1609791 -VAT number: EE102345621.